薄膜工藝產(chǎn)品說明書翻譯-中英對照
主要用于微波、毫米波電路、高精密電路、光電子器件等。
產(chǎn)品有：微波衰減片、微波功分器、薄膜基板、精密電阻網(wǎng)絡(luò)（芯片式）
（配相關(guān)照片）
1. Thin-film Technology Products
Mainly used for microwave, millimeter-wave circuits, high-precision circuits, optoelectronic devices.
Products include microwave attenuation film, microwave power divider, thin-film substrates, precise resistor network (Chip)
(Related photos provided)
2、封裝外殼
華東微電子技術(shù)研究所封裝事業(yè)部是中國領(lǐng)先的金屬外殼供應(yīng)商。生產(chǎn)的外殼產(chǎn)品共7個系列，400多個品種，外殼年產(chǎn)量達到50萬套以上；外殼主要應(yīng)用于混合集成電路、光電器件、半導(dǎo)體器件、聲表面波器件、微波器件、壓力傳感器、固態(tài)繼電器等產(chǎn)品的氣密封裝。外殼性能和可靠性指標達到MIL-STD-883E標準要求。華東微電子技術(shù)研究所的外殼產(chǎn)品不僅在國內(nèi)各行業(yè)得到廣泛應(yīng)用，并且出口到意大利、韓國、美國、泰國、新加坡、英國等國。
2. Packaging Shell
Packaging Division of East China Micro-electronics Technology Research Institute is a domestic leading supplier of the metal shell. Shell products include seven series, more than 400 species; with annual output more than 500,000 units. Shell products are mainly used in Hermetic packaging of hybrid integrated circuits, optoelectronic devices, semiconductor, acoustic surface wave devices, microwave devices, pressure sensors, and solid-state relays. Shell performance and reliability reach MIL-STD-883E standards. Shell products of East China Institute of Microelectronic Technology are not only widely used domestic industry, but also export to Italy, South Korea, the United States, Thailand, Singapore, the United Kingdom and other countries.
外殼底座材料： 可伐合金（4J29）、冷軋鋼、無氧銅、鎢銅、鐵鎳合金（4J42）、316L、304L等
外殼封蓋材料： 可伐合金（4J29）、鐵鎳合金（4J42）等
外殼引線材料： 可伐合金（4J29）、4J50、銅芯復(fù)合等
Shell base material: Kovar alloy (4J29), cold-rolled steel, oxygen-free copper, tungsten copper, iron-nickel alloy (4J42), 316L, 304L, etc.
Shell capping material: Kovar alloy (4J29), iron-nickel alloy (4J42)，etc.
Shell lead-wire material: Kovar alloy (4J29), 4J50, copper-core composite, etc.
3. LTCC生產(chǎn)線簡介
華東微電子技術(shù)研究所擁有一條LTCC產(chǎn)品研制生產(chǎn)線，LTCC產(chǎn)品包括微波/毫米波電路，數(shù)字/模擬電路（MCM）以及無源集成元件等，如有源相控陣雷達T/R組件（S、C、X波段）、L波段雷達接收機前端模塊、毫米波接收前端模塊、毫米波無線引信模塊、數(shù)字軸角轉(zhuǎn)換器、量化器、濾波器、功分器、各種微波多層布線基板等，相關(guān)產(chǎn)品廣泛應(yīng)用于對于體積、重量和可靠性有要求的專業(yè)領(lǐng)域。
3. Introduction of LTCC Product Line
East China Micro-electronics Technology Research Institute has a LTCC development and production line. LTCC products include microwave/millimeter-wave circuits, digital/analog circuits (MCM) and passive integrated components, active phased array radar T/R module (S , C, X-band), L-band radar receiver front-end modules, millimeter wave receiver front-end modules, millimeter-wave wireless fuse module, digital rotary converters, quantizers, filters, power-dividers, and various microwave multi-layer line substrates. Related products are widely used in professional fields where requirements in size, weight and reliability are needed.
LTCC研制生產(chǎn)線的工藝水平如下：
線寬/間距 75μm
線條精度 ≤±5μm
翹曲度 ＜3mil/in
埋置元件 電阻、電容、電感
層數(shù) 30層
基板尺寸 150mm×150mm
檢驗標準 GJB2438A《混合集成電路通用規(guī)范》H級要求（相當(dāng)于MIL-PRF-38534的H級）
Technology level of LTCC development and production line are as follows:
line-width/spacing 75 μm
line accuracy ≤ ± 5 μm
warp-degree <3mil/in
embedded components resistors, capacitors, inductors
number of layers 30
size of substrates 150mm × 150mm
inspection standards GJB2438A H-level requirements "Hybrid Integrated Circuits General Specification" (equivalent to MIL-PRF-38534 H-level)
4.ALN陶瓷基片(圣達公司材料)
用途及特點：主要應(yīng)用于高功率混合集成電路、微波功率器件、半導(dǎo)體功率器件、電力電子器件、光電子部件、半導(dǎo)體致冷器等產(chǎn)品中作高性能基片材料和封裝材料。其特點是熱導(dǎo)率高，電性能好，熱脹系數(shù)與硅片接近，機械強度高，無毒性，是取代BeO陶瓷的理想材料。
4. ALN ceramic substrate (Shengda Co.’s material)
Uses and features:
Mainly used as high performance substrate materials and packaging materials in high-power hybrid integrated circuits, microwave power devices, semiconductor power devices, electronic power devices, optoelectronics components, and semiconductor Cooling products. They are characterized by high thermal conductivity, good electrical properties, with thermal expansion coefficient close to silicon, high mechanical strength, non-toxic, and are the ideal substitute materials of BeO ceramic.
5.ALN陶瓷粉料
產(chǎn)品特點：是改善制成品的散熱性和耐磨性。顆粒度細，純度高，雜質(zhì)含量低，粉料為ALN結(jié)晶相。
5. ALN ceramic powder
Features:
Improve manufactures’ thermal and wear resistance. Fine particle size, high purity, low impurity content, powders are ALN crystalline phase.
6.金屬化ALN基片
ALN基片在應(yīng)用中需要金屬化。本公司可按用戶對金屬化基片不同用途及性能/價格比的要求，提供不同金屬化ALN基片。
6. Metallized ALN substrate
ALN substrate needs to be metallized in the application. We can provide different metallized ALN substrate according to users’ requirements of uses and performance/price ratio.
7.KPB型晶閘管保護裝置
用途及特點：采用低壓高能MYN型ZnO壓敏電阻器作為核心元件，是取代阻容（RC）模式裝置的換代產(chǎn)品，用于大容量電力電子器件可控硅的過電壓保護和能量吸收。具有限壓、吸能雙重功能，響應(yīng)速度快（ns），自身功耗低（＜0.3W），節(jié)能顯著，吸收能量大、重量輕、價格低、安裝和維修方便。
7. KPB thyristor-protection device
Uses and features:
Using low-voltage high-energy MYN-type ZnO varistor as core component, it is substitute device of resistance-capacitance (RC) model. Mainly used for overvoltage protection and energy absorption for large-capacity power electronic devices thyristor. They are characterized by double functions--limiting pressure and absorbing energy, fast response (ns), low power consumption (<0.3 W), significant energy conservation, great energy absorption, light weight, low price and easy to install and maintain.
8.氧化鋅壓敏電阻器
用途及特點：廣泛用于電力系統(tǒng)和電子線路中作瞬時過電壓保護器件。具有電壓非線性系數(shù)大、殘壓低、耐浪涌能力強、使用電壓范圍寬等特點。
8. Zinc oxide varistor
Uses and features:
It is widely used as transient over-voltage protection devices in power systems and electronic lines, and is characterized by high voltage coefficient of nonlinear, low residual voltage, strong resistance of surge voltage, and wide range of working voltage.
9.RYC型避雷器間隙專用高壓電阻器
產(chǎn)品特點：
1、提高避雷器耐受系統(tǒng)短時工頻過電壓能力。
2、減輕ZnO閥片運行負擔(dān)，降低閥片荷電率，提高閥片使用壽命。
3、間隙放電穩(wěn)定好，分散性小。
4、降低避雷器殘壓和沖擊系數(shù)，減小放電時延，提高響應(yīng)速度。
5、結(jié)構(gòu)簡單，調(diào)整方便。
9. High-voltage resistor dedicated for RYC type arrester space
Features:
1. Improve arrester’s tolerance system’s capacity of short-term power frequency over-voltage
2. Reduce the operation burden of ZnO valve, reduce the valve charge rate, and improve the valve’s service life.
3. Good gap discharge stability, and small scatteredness.
4. Reduce arrester’s residual voltage, reduce discharge delay and improve response time.
5. Simple structure and easy to adjust
設(shè)備類：(恒力公司)
電子專用設(shè)備：
網(wǎng)帶爐 燒結(jié)爐(照片)
Equipments (Hengli Co.)
Electronic Special Equipments:
Net Belt Furnace, Sintering Furnace (photo)
用于厚膜電路、電子元件電極、LTCC、鋼加熱器、太陽能電池板等產(chǎn)品的高溫?zé)Y(jié)、熱處理
用于芯片焊接、金屬封裝、HTCC、DBC、VFD、PDP、汽車散熱器、餐具等產(chǎn)品在保護氣氛下的熔封、金屬化、釬焊、氧化、退火等熱處理工藝
鐘罩爐(照片)
用于磁性材料、陶瓷材料、電子元件、粉末冶金產(chǎn)品等的預(yù)燒、燒結(jié)、共燒
推板爐(照片)
用于陶瓷材料、電子元件、粉末冶金產(chǎn)品的大批量排膠、預(yù)燒、燒結(jié)、退火等熱處理過程
電鍍生產(chǎn)線(照片)
用于鍍金、鍍鎳、鍍錫、鍍銅、鍍銀、鋁氧化、磷化、電解拋光等多種化學(xué)處理過程，如電子元件電極電鍍、電子封裝電鍍等
Used for high-temperature sintering, heat treatment of thick-film circuit, electronic components electrode, LTCC, steel heaters, solar panels and other products.
Used for melt-sealing, metallizing, brazing, oxidation, annealing and other heat treatment process for chips-welding, metal-packaging, HTCC, DBC, VFD, PDP, car radiators, tableware and other products in the protective atmosphere.
Bell Furnace (photo)
Used for pre-burning, sintering and co-firing for magnetic materials, ceramic materials, electronic components, powder metallurgy products, etc.
Pushing plate Furnace (photo)
Used for large quantities of heat treatment process such as rubber-removing, pre-burning, sintering, annealing for ceramic materials, electronic components, powder metallurgy products.
Electroplating production line (photo)
Used for gold-plating, nickel-plating, tinning, copper-plating, silver-plating, aluminum-oxide, phosphating, electrolytic polishing, and other chemical processes, such as electroplating electronic component electrode, electronic package-electroplating, etc.
（照片）
1.EDA中心
２.厚膜生產(chǎn)線
３.激光劃片機
４.濺射磁控設(shè)備
５.激光焊接機
６.圖形檢查系統(tǒng)
７.等靜壓測試
８.MCM印刷
9.封裝數(shù)控
10.電子掃描顯微鏡
11.水汽含量分析儀
12.產(chǎn)品老化系統(tǒng)
13.X射線檢查系統(tǒng)
14.LTCC基板
15.S波段
16.C波段
17.X波段
18.產(chǎn)品介紹
19.材料
20.精密薄膜電阻
21.材料產(chǎn)品推廣部
22.電路產(chǎn)品推廣部
23.封裝外殼推廣部
24.設(shè)備產(chǎn)品推廣部
(photo)
1. EDA Center
2. Thick-film Production Line
3. Laser Dicing Machine
4. Magnetron sputtering equipment
5. Laser welding machine
6. Graphics Inspection System
7. Isostatic Pressing test
8. MCM printing
9. Numerical Control Packaging
10. Electron Scanning Microscope
11. Vapor content analyzer
12. Product Aging system
13. X-ray Inspection System
14. LTCC substrates
15. S band
16. C band
17. X-band
18. Product introduction
19. Material
20. Precision thin-film resistor
21. Material Products Promotion Division
22. Circuit Products Promotion Division23. Packaging Shell Promotion Division
24. Equipment Products Promotion Division
2012.12.21